Samsung, AMD, Nvidia, and Groq Showcase AI Memory Solutions at US Summit

Samsung Electronics presented next-generation memory and storage technologies at the 2026 OCP Global Summit in the United States. The company jointly demonstrated a Compute Express Link (CXL)-based memory expansion solution with AMD. This solution uses Samsung's CMM-D-based memory pooling technology to allow multiple systems to share memory flexibly for AI inference. Samsung also displayed high-performance memory products, including customized HBM and HBM5, and processing-in-memory technology.

The event highlights the rising demand for memory capacity, faster data processing, and efficient storage as AI models grow larger and handle more complex tasks. The joint demonstration addresses challenges in AI systems by allowing processors and components to share memory resources without relying solely on installed memory. This showcases the ongoing push for advanced infrastructure to handle growing AI workloads.