Slowing HBM expansion is causing capacity to be redirected to DRAM production by Micron Technology and SK Hynix.
2 reports, 2 independent
Updated Jul 14
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New informationRepeats or wire copies
AI-generated analysis. Brind wrote this summary from the reports listed below. It can be wrong. Each section says how much you can rely on it, and the sources are linked so you can check.
What happened
Slowing HBM expansion is causing capacity to be redirected to DRAM production by Micron Technology and SK Hynix.
Who's involved
What this event is mainly aboutHow it developed
Newest first. Tap a step to see who reported it.- Micron's supply decisions regarding HBM3E production requirements led to DRAM scarcity.Sub-event
Production capacity is shifting from HBM to DRAM due to slowing HBM expansion.1 source
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The entities involved
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Micron Technology
American multinational corporation based in Boise, Idaho
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SK Hynix
South Korean memory semiconductor supplier
Related events
- Robust demand for HBM products drove DRAM revenues in July 2025.
- Samsung and SK Hynix are building new memory fabs as the Korean government aims to double DRAM production capacity.
- Storage and memory technologies are converging, driving sector rotation into storage stocks amid high AI-bandwidth memory demand.
- Technical advancements in HBM design, including NVHBM solutions and memory controller tricks, were announced by Micron, Nvidia, and Qualcomm.
- SK Hynix and Samsung are gaining market share and achieving dominance in high-bandwidth memory (HBM) chips crucial for AI infrastructure.