Slowing HBM expansion is causing capacity to be redirected to DRAM production by Micron Technology and SK Hynix.
2 reports, 2 independent
Updated Jul 14
Gone quiet
- Reports
- 2
- Developments
- 2
- Repetition
- 50%
New informationRepeats or wire copies
AI-generated analysis. Brind wrote this summary from the reports listed below. It can be wrong. Each section says how much you can rely on it, and the sources are linked so you can check.
What happened
Slowing HBM expansion is causing capacity to be redirected to DRAM production by Micron Technology and SK Hynix.
Who's involved
What this event is mainly aboutHow it developed
Newest first. Tap a step to see who reported it.- Micron's supply decisions regarding HBM3E production requirements led to DRAM scarcity.Sub-event
Production capacity is shifting from HBM to DRAM due to slowing HBM expansion.1 source
Keep exploring
The entities involved
-
Micron Technology
American multinational corporation based in Boise, Idaho
- Competing in the high-value AI memory chip market, major players like Micron, SK Hynix, Samsung, and TSMC are vying for market leadership in advanced electronics powered by AI chipsets.
- Declines are being noted in the tech sector sell-off, causing market indices to be impacted and shifting focus away from geopolitical events.
-
SK Hynix
South Korean memory semiconductor supplier
Related events
- Market size projections indicate that both Micron Technology and SK Hynx are leading high-bandwidth memory producers.
- Storage and memory technologies are converging, driving sector rotation into storage stocks amid high AI-bandwidth memory demand.
- Micron Technology is abandoning its 4F² DRAM design.
- SK Hynix and Samsung are gaining market share and achieving dominance in high-bandwidth memory (HBM) chips crucial for AI infrastructure.
- Micron Technology is facing soaring demand for advanced memory solutions and is investing in next-generation 3D NAND technology.